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Dassault Systèmes (Japan) | Researchclopedia

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Dassault Systèmes (Japan)

Tokyocompany

75

Works

1,276

Citations

17

h-index

Top Research Topics

Epoxy Resin Curing Processes Intermetallics and Advanced Alloy Properties Synthesis and properties of polymers

Top Researchers

Tatsuhiko Kodama Tokyo University of Science

596 works50,414 citationsh-index: 104

Recent Research

Interfacial thermal transport analysis using machine learning potential at AlN/Cu van der Waals interface

Weitao Wang,Xin Wu,et al.

20260 citations

Advanced Chemical Physics Studies

Surface Modification and Superhydrophobicity

Semiconductor materials and devices

Systems Engineering Methodologies and Applications

Photopolymerization techniques and applications

Ferroelectric and Negative Capacitance Devices

Modeling and Simulation Systems

Carbon Nanotubes in Composites

Polymer composites and self-healing

Teruyuki Nakajima Tokai University

514 works28,844 citationsh-index: 69

318 works14,898 citationsh-index: 63

Masahiro Mori Chiba University

562 works12,986 citationsh-index: 58

Hiroshi Taniguchi Fujita Health University

729 works8,147 citationsh-index: 45

Alexandros Gasparatos The University of Tokyo

197 works6,736 citationsh-index: 43

Hygrothermal degradation mechanism of amine-cured epoxy resin

Ko Yamaguchi,Atsuomi Shundo,et al.

20261 citations

Molecular picture of curing and incomplete cross-linking of epoxy at a solid interface

Shunsuke Yamamoto,Riichi Kuwahara,et al.

20260 citations

Breakdown and polarization contrasts in ferroelectric devices observed by operando laser-based photoemission electron microscopy with the AC/DC electrical characterization system

Hirokazu Fujiwara,Yuki Itoya,et al.

20250 citations

Dehydrogenative Coupling of Ethanol to Ethyl Acetate in Compressed CO<sub>2</sub>: An Acceptor-Less Approach

Maya Chatterjee,Abhijit Chatterjee,et al.

20252 citations

Neuroprotective Potential of Lactic Acid Oligomers Derived from Heat-Killed Lacticaseibacillus paracasei HK-PS23

Yhiya Amen,Chunguang Han,et al.

20250 citations