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STMicroelectronics (Singapore) | Researchclopedia

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STMicroelectronics (Singapore)

Singaporecompany

314

Works

8,666

Citations

44

h-index

Top Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Silicon Carbide Semiconductor Technologies

Top Researchers

Xin Yao Xichang University

1,457 works67,046 citationsh-index: 116

Recent Research

Transmit-Receive Performance Enhancement of $\text{Sc}_{0.3}\text{AL}_{0.7}\mathrm{N}$ Pmuts Through Ferroelectric Activation

Jihang Liu,Subhranu Samanta,et al.

20260 citations

Electromagnetic Compatibility and Noise Suppression

Electrostatic Discharge in Electronics

Semiconductor materials and devices

Advanced MEMS and NEMS Technologies

Acoustic Wave Resonator Technologies

Mechanical Behavior of Composites

Advancements in Semiconductor Devices and Circuit Design

Speech and Audio Processing

Advanced Adaptive Filtering Techniques

Xinliang Zhang Hebei Medical University

1,552 works19,447 citationsh-index: 63

Francky Catthoor National Technical University of Athens

1,390 works18,156 citationsh-index: 57

Paul S. Ho The University of Texas at Austin

551 works12,099 citationsh-index: 57

Howard Jay Siegel Colorado State University

554 works11,927 citationsh-index: 51

101 works9,011 citationsh-index: 21

Bistable Bimorph PMUT with Large Switching Displacement and Acoustic Output

Shyam Trivedi,Prakasha Chigahalli Ramegowda,et al.

20260 citations

Influenza A virus derived NS1 enhances translation of HPLC purified mRNA and interferon adjuvanted mRNA vaccination

Kyle K. L. Phua,Yi Liu,et al.

20260 citations

Correlation Between Thermal Cycling Ramp Rates and its Respective Solder Joint Reliability

Yong Tat Chan,Kim-Sing Wong,et al.

20250 citations

Reliability Study of a New PFAS-Free Passivation Material for WLCSP

Y. Chen,David Gani,et al.

20250 citations

Thick 4 Mils Heavy Cu Wire Ball Bonding Feasibility Study

Edsel De Jesus,Loic Renard,et al.

20250 citations