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National Center for Advanced Packaging (China) | Researchclopedia

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National Center for Advanced Packaging (China)

Wuxicompany

501

Works

9,073

Citations

41

h-index

Top Research Topics

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Material Properties and Processing

Top Researchers

Huan Liu Wannan Medical College

3,421 works141,915 citationsh-index: 174

Recent Research

Ultrasound-Assisted Processing of Amorphous Hydrated Carbon Oxide from Plant Origin: Properties and Biocompatibility of Conductive Nanocomposites as a Proposal for Food Packaging

Kelvi W. E. Miranda,Francislei S. A. Santos,et al.

20260 citations

Electromagnetic Compatibility and Noise Suppression

Microwave Engineering and Waveguides

Semiconductor Lasers and Optical Devices

Photonic and Optical Devices

Semiconductor materials and devices

Nanocomposite Films for Food Packaging

Nanofabrication and Lithography Techniques

Copper Interconnects and Reliability

Additive Manufacturing and 3D Printing Technologies

Khalil Amine Earth University

1,172 works109,249 citationsh-index: 180

Lei Wang Minzu University of China

5,907 works108,139 citationsh-index: 137

1,446 works79,421 citationsh-index: 118

Feng Chen Education Department of Fujian Province

939 works41,042 citationsh-index: 103

Jun Li Ningbo University

1,355 works38,890 citationsh-index: 94

Curcumin-Activated Copolymer Coatings for Barrier Enhancement and Antioxidant Activity in Recycled Polypropylene

Eliezer Velásquez,Carol López-de-Dicastillo,et al.

20260 citations

A Novel Method for Maturity Assessment of Edamames with Pod Using HSI

Tianrui Zhou,Xiangquan Gao,et al.

20260 citations

Multifunctional organic-inorganic hybrid anti-fouling coating with high transparency, hardness and UV-resistance

Wenfeng Xie,Yuwei Hao,et al.

20260 citations

Environmental impact analysis of molded pulp cups based on different LCA tools

Nuan Zhang,Qinghua Yang,et al.

20260 citations

Cell‐Offset Honeycombs With Enhanced Plateau Stress and Energy Absorption Under In‐Plane Impact Loading

Chuanlin Zhou,Feng Zhang,et al.

20260 citations