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Circuits, interconnections, and packaging for VLSI | Researchclopedia

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Circuits, interconnections, and packaging for VLSI

19901,929 citationsBook

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Topics & Keywords

3D IC and TSV technologies Electronic Packaging and Soldering Technologies VLSI and FPGA Design Techniques

Publication Details

Published in: Medical Entomology and Zoology

Field-Weighted Citation Impact: 34.89