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Chip-To-Package Interconnections

199749 citationsBook Chapter

Authors

P. A. Totta · IBM (United States)

Subash Khadpe · ON Semiconductor (United States)

Nicholas G. Koopman

T.C. Reiley · IBM (United States)

Michael J. Sheaffer · Kulicke & Soffa (United States)

Topics & Keywords

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Electrowetting and Microfluidic Technologies

Publication Details

DOI: 10.1007/978-1-4615-6037-1_2

Field-Weighted Citation Impact: 8.69

Chip-To-Package Interconnections | Researchclopedia