Silicon on insulator material technology

1995999 citationsJournal Article

Authors

Abstract

A silicon on insulator material technology based on wafer bonding is described, in which a heat treatment induces an in-depth microslicing of one of the two bonded wafers previously implanted with hydrogen. The basic phenomena, and the first physical and electrical characterisations are discussed briefly.

Topics & Keywords

3D IC and TSV technologies Silicon and Solar Cell Technologies Advanced Surface Polishing Techniques

Publication Details

Published in: Electronics Letters

Volume 31, Issue 14, pp. 1201-1202

DOI: 10.1049/el:19950805

Field-Weighted Citation Impact: 31.73

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Silicon on insulator material technology

Authors

Abstract

Topics & Keywords

Publication Details