Measurement and Application of Dielectric Properties

198611 citationsJournal Article

Authors

M.C. Bromberg · Microtech Instruments (United States)

David R. Day · Microtech Instruments (United States)

Kimberley Snable · Microtech Instruments (United States)

Abstract

Recent developments permit the use of dielectric properties measurements to gauge the cure of thermosetting resins under real-time operating conditions.

Topics & Keywords

Epoxy Resin Curing Processes Synthesis and properties of polymers Electronic Packaging and Soldering Technologies

UN Sustainable Development Goals

Affordable and clean energy

Publication Details

Published in: IEEE Electrical Insulation Magazine

Volume 2, Issue 3, pp. 18-24

DOI: 10.1109/mei.1986.290407

Field-Weighted Citation Impact: 4.16