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New, lead-free solders

1994168 citationsJournal Article

Authors

M. McCormack · AT&T (United States)

S. Jin · AT&T (United States)

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies

Publication Details

Published in: Journal of Electronic Materials

Volume 23, Issue 7, pp. 635-640

DOI: 10.1007/bf02653349

Field-Weighted Citation Impact: 3.17

New, lead-free solders | Researchclopedia