Carbon‐Nanotube Through‐Silicon Via Interconnects for Three‐Dimensional Integration

201176 citationsJournal Article

Authors

Teng Wang · Chalmers University of Technology

Kejll Jeppson · Chalmers University of Technology

Abstract

Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measurements are approximately 1.2 × 10(-3) Ω cm(2) and 4.5 × 10(-4) Ω cm(2) , respectively.

Topics & Keywords

Nanowire Synthesis and Applications Molecular Junctions and Nanostructures Carbon Nanotubes in Composites

Publication Details

Published in: Small

Volume 7, Issue 16, pp. 2313-2317

DOI: 10.1002/smll.201100615

Field-Weighted Citation Impact: 6.92

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Carbon‐Nanotube Through‐Silicon Via Interconnects for Three‐Dimensional Integration

Authors

Abstract

Topics & Keywords

Publication Details