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Cracking of thin bonded films in residual tension

1992634 citationsJournal Article

Authors

Jack Beuth · Harvard University

Topics & Keywords

Metal and Thin Film Mechanics Electronic Packaging and Soldering Technologies Metal Forming Simulation Techniques

Publication Details

Published in: International Journal of Solids and Structures

Volume 29, Issue 13, pp. 1657-1675

DOI: 10.1016/0020-7683(92)90015-l

Field-Weighted Citation Impact: 8.42

Cracking of thin bonded films in residual tension | Researchclopedia