Some examples of current diffusion bonding applications

Abstract In recent years a renaissance of diffusion bonding can be observed. Beside applications in the aerospace industry more and more industrial users take advantage of the solid state joining process. The progressive development of micro technologies results from the systematic miniaturization efforts for electrical, optical and mechanical components. A major role for this is taken by the application of scale effects. Today, micro structured‐components are already deployed in telecommunication, mechanical engineering, medicine‐ and biotechnology. During this continuous top‐down process the performance of a component should at least be equal or rather enhanced as compared to the conventional processed part. Increasing computational power needs a safely controlled and managed heat generation and distribution in any of such components. This is not only important for electronic devices, but also for tools used for micro injection molding. With the combination of machining or laser cutting and subsequent diffusion bonding it is possible to freely design and manufacture the required parts with an inside structure. In this paper an enhanced process chain for production of parts by a lamination technology, which is capable to solve scale restrictions, is presented as well as application examples and process specific features, Fig. 1.