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Basic mechanisms involved in the Smart-Cut® process

1997139 citationsJournal Article

Authors

B. Aspar · CEA Grenoble

M. Bruel · CEA Grenoble

H. Moriceau · CEA Grenoble

Christophe Maleville · CEA Grenoble

T. Poumeyrol · Commissariat à l'Énergie Atomique et aux Énergies Alternatives

A.M. Papon · CEA Grenoble

Topics & Keywords

Silicon and Solar Cell Technologies Integrated Circuits and Semiconductor Failure Analysis Advanced Surface Polishing Techniques

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: Microelectronic Engineering

Volume 36, Issue 1-4, pp. 233-240

DOI: 10.1016/s0167-9317(97)00055-5

Field-Weighted Citation Impact: 9.15

Basic mechanisms involved in the Smart-Cut® process | Researchclopedia

Centre d’Élaboration de Matériaux et d’Études Structurales

G. Benassayag · Centre d’Élaboration de Matériaux et d’Études Structurales

A.J. Auberton‐Hervé · Soitec (France)

T. Barge · Soitec (France)