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Reliability of thermal interface materials: A review

2012240 citationsReview

Authors

Jens Due · Keele University

A.J. Robinson · Trinity College Dublin

Topics & Keywords

Thermal properties of materials Electronic Packaging and Soldering Technologies Heat Transfer and Optimization

UN Sustainable Development Goals

Responsible consumption and production

Publication Details

Published in: Applied Thermal Engineering

Volume 50, Issue 1, pp. 455-463

DOI: 10.1016/j.applthermaleng.2012.06.013

Field-Weighted Citation Impact: 2.11

Reliability of thermal interface materials: A review | Researchclopedia