LBNL four-side buttable CCD package development

20045 citationsJournal Article

Authors

Hakeem M. Oluseyi · Lawrence Berkeley National Laboratory

J. Bercovitz · Lawrence Berkeley National Laboratory

Armin Karcher · Lawrence Berkeley National Laboratory

C. Hernikl · Lawrence Berkeley National Laboratory

Tom Miller · Lawrence Berkeley National Laboratory

M. Uslenghi · Lawrence Berkeley National Laboratory

Natalie Roe

Abstract

We have developed a precision, 4-side buttable CCD package for 2kx2k and 2kx4k format devices with minimal mechanical stress on the CCD, excellent thermal properties, reliable electrical connectivity, and shim-free mounting. We report on the package design, assembly and quality assurance procedures, measurements of packaged device flatness and flatness excursions when cooled from room temperature to 140 K, package performance and plans for future development.

Topics & Keywords

CCD and CMOS Imaging Sensors Infrared Target Detection Methodologies Image Processing Techniques and Applications

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Volume 5301, pp. 87-87

DOI: 10.1117/12.531954

Field-Weighted Citation Impact: 0.66