A thermal benchmark chip: design and applications

199817 citationsJournal Article

Authors

V. Székely · Eötvös Loránd University

Cs. Márta · Eötvös Loránd University

M. Rencz · Eötvös Loránd University

G. Vegh · Budapest Institute

Z. Benedek · Eötvös Loránd University

S. Török · Budapest Institute

Abstract

A 1.2-/spl mu/m complementary metal-oxide-semiconductor (CMOS) thermal benchmark chip has been designed, fabricated and tested. The chip is suitable to support various steady-state and transient measurements, e.g., heating and cooling curves, in-chip thermal couplings. It facilitates the calibration of various chip temperature mapping equipment. Besides the description of the chip design experimental results are presented in order to demonstrate the wide usability of this measurement supporting tool.

Topics & Keywords

Advancements in Semiconductor Devices and Circuit Design Heat Transfer and Optimization Silicon Carbide Semiconductor Technologies

UN Sustainable Development Goals

Affordable and clean energy

Publication Details

Published in: IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volume 21, Issue 3, pp. 399-405

DOI: 10.1109/95.725202

Field-Weighted Citation Impact: 1.05