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Characterization of silicon wafer bonding for Power MEMS applications

200231 citationsJournal Article

Authors

Arturo A. Ayón

Xin Zhang · Fraunhofer USA

Kevin T. Turner · Massachusetts Institute of Technology

Dongwon Choi · Massachusetts Institute of Technology

Bruno Miller · Massachusetts Institute of Technology

Steven F. Nagle · Massachusetts Institute of Technology

S.M. Spearing · Massachusetts Institute of Technology

Topics & Keywords

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Advanced MEMS and NEMS Technologies

Publication Details

Published in: Sensors and Actuators A Physical

Volume 103, Issue 1-2, pp. 1-8

DOI: 10.1016/s0924-4247(02)00329-1

Field-Weighted Citation Impact: 2.74

Characterization of silicon wafer bonding for Power MEMS applications | Researchclopedia