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Die bond materials and bonding mechanisms in microelectronic packaging

198719 citationsJournal Article

Authors

Guna S Selvaduray · San Jose State University

Topics & Keywords

3D IC and TSV technologies Electronic Packaging and Soldering Technologies

Publication Details

Published in: Thin Solid Films

Volume 153, Issue 1-3, pp. 431-445

DOI: 10.1016/0040-6090(87)90203-3

Field-Weighted Citation Impact: 1.59

Die bond materials and bonding mechanisms in microelectronic packaging | Researchclopedia