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Behavior of tin whisker formation and growth on lead-free solder finish

200547 citationsJournal Article

Authors

Kyung-Seob Kim · Yeoju University

C.H. Yu · Electronics and Telecommunications Research Institute

Jun‐Mo Yang · National NanoFab Center

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Intermetallics and Advanced Alloy Properties

Publication Details

Published in: Thin Solid Films

Volume 504, Issue 1-2, pp. 350-354

DOI: 10.1016/j.tsf.2005.09.088

Field-Weighted Citation Impact: 3.99

Behavior of tin whisker formation and growth on lead-free solder finish | Researchclopedia