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Nickel–palladium bond pads for copper wire bonding

201071 citationsJournal Article

Authors

Horst Clauberg · Kulicke & Soffa (United States)

Petra Backus · Atotech (Germany)

Bob Chylak · Kulicke & Soffa (United States)

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: Microelectronics Reliability

Volume 51, Issue 1, pp. 75-80

DOI: 10.1016/j.microrel.2010.05.001

Field-Weighted Citation Impact: 9.98

Nickel–palladium bond pads for copper wire bonding | Researchclopedia