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Analysis Of “Invisible” Poly-Bump Defect With EFTEM Spectral Imaging

20090 citationsJournal Article

Authors

R. R. Rios · SPX Corporation (United States)

A. Malcolm Gill

Abstract

Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009

Topics & Keywords

Integrated Circuits and Semiconductor Failure Analysis Electron and X-Ray Spectroscopy Techniques Industrial Vision Systems and Defect Detection

UN Sustainable Development Goals

Climate action

Publication Details

Published in: Microscopy and Microanalysis

Volume 15, Issue S2, pp. 1242-1243

DOI: 10.1017/s1431927609093325

Field-Weighted Citation Impact: 0.00

Analysis Of “Invisible” Poly-Bump Defect With EFTEM Spectral Imaging | Researchclopedia