Silicon as tool material for polymer hot embossing

Polymer microfabrication methods are becoming increasingly important as low-cost alternatives to the silicon or glass-based MEMS technologies. We present in this paper the results of the direct usage of silicon which has been micromachined with various technologies as a tool material for hot embossing of polymers. This represents a significant reduction in cost and fabrication time for an embossing master in comparison to the previously used nickel tools as well as allowing access to high aspect ratio structures without the need of complex technologies like LIGA. Additionally, the wear of a silicon tool is much smaller compared to a traditional nickel tool.