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High temperature lead-free solder for microelectronics

200172 citationsJournal Article

Authors

Frank W. Gayle · National Institute of Standards and Technology

G.A. Becka · Allied Technology (United States)

Ahmer Syed · Amkor Technology (United States)

Jerry L. Badgett · Aptiv (United States)

Gordon Whitten · Aptiv (United States)

Tsung‐Yu Pan · Ford Motor Company (United States)

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Aluminum Alloy Microstructure Properties

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: JOM

Volume 53, Issue 6, pp. 17-21

DOI: 10.1007/s11837-001-0097-5

Field-Weighted Citation Impact: 3.48

High temperature lead-free solder for microelectronics | Researchclopedia

· Heraeus (United States)

Brian S. Bauer · Heraeus (United States)

Rick Lathrop · Heraeus (United States)

J.A. Slattery · Indium Corporation (United States)

Iver E. Anderson · Iowa State University

Jim Foley · Iowa State University

Alan E. Gickler · Johnson & Johnson (United States)

D. Napp · National Center for Manufacturing Sciences

John Mather · Rockwell Automation (United States)

Chris Olson · Rockwell Automation (United States)