Fine line circuit manufacturing technology with electroless copper plating

200216 citationsJournal Article

Authors

Haruo Akahoshi · Hitachi (Japan)

M. Kawamoto · Hitachi (Japan)

Takeyuki Itabashi · Hitachi (Japan)

Osamu Miura · Hitachi (Japan)

Akio Takahashi · Hitachi (Japan)

Sachiko Kobayashi · Powerchip (Taiwan)

M. Miyazaki · Hitachi (Japan)

Abstract

Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed. The processes offer high dimensional accuracy. Technical aspects of the additive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>

Topics & Keywords

3D IC and TSV technologies Electrodeposition and Electroless Coatings Electronic Packaging and Soldering Technologies

Publication Details

DOI: 10.1109/ectc.1994.367562

Field-Weighted Citation Impact: 1.70

Command Palette

Fine line circuit manufacturing technology with electroless copper plating

Authors

Abstract

Topics & Keywords

Publication Details