Search for a command to run...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that large degradations occur in the material properties (stiffness and strength) and creep behavior of Sn-Ag-Cu (SAC) lead free solders during aging. These effects are universally detrimental to reliability and are exacerbated as the aging temperature and aging time increases. Conversely, changes due to aging have been shown to be relatively small in conventional Sn-Pb solders. Aging effects for lead free solder materials are especially important for the harsh applications environments present in high performance computing and in automotive, aerospace, and defense applications. In the current investigation, we have extended our previous studies to include a full test matrix of aging temperatures and SAC lead free solder alloys. In an attempt to reduce the aging induced degradation of the material behavior of SAC solders, we are also exploring various doped SAC-X alloys. These materials are SAC solders that have been modified by the addition of small percentages of one or more additional elements (X). Using dopants (e.g. Bi, In, Ni, La, Mg, Mn, Ce, Co, Ti, Zn, etc.) has become widespread to enhance shock/drop reliability, wetting, and other properties; and we have extended this approach to examine the ability of dopants to reduce the effects of aging and extend thermal cycling reliability. The effects of aging on mechanical behavior have been examined by performing stress-strain and creep tests on solder samples that were aged for various durations (0-6 months) at room temperature (25°C), and several elevated temperatures (50, 75, 100, and 125°C). Four “standard” SAC alloys have been examined in this work including SAC105, SAC205, SAC305, and SAC405. This selection has allowed us to explore the effects of silver content on aging behavior (we have examined SACN05 with N= 1%, 2%, 3%, and 4% silver; with all alloys containing 0.5% copper). The doped SAC solder materials being considered in our ongoing studies include SAC0307-X, SAC105-X, and SAC305-X. In this work, we will concentrate on presenting the results for SAC0307-X (SAC-X), where X is 0.1%Bi. This alloy has been proposed as a lower cost SAC variation suitable for enhancing drop reliability. For all of the solders, variations of the mechanical and creep properties (elastic modulus, yield stress, ultimate strength, creep compliance, etc.) were observed and modeled as a function of aging time and aging temperature. Our findings show that the doped SAC-X alloy illustrates reduced degradations with aging for all of the aging temperatures considered. The stress-strain and creep mechanical properties of SAC-X are better than those of SAC105 after short durations of aging, and approach those of SAC205 with longer aging times. After long term aging, the SAC-X alloy was found to have more stable behavior than all of the standard SACN05 alloys. Analogous tests were performed with 63Sn-37Pb eutectic solder samples for comparison purposes.