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Material Removal Mechanisms in Lapping and Polishing

2003379 citationsJournal Article

Authors

C. J. Evans · Zygo (United States)

E. Paul · Stockton University

D. Dornfeld · University of California, Berkeley

D.A. Lucca · Oklahoma State University

Greg Byrne · University College Dublin

Marc Tricard · QED Technologies (United States)

Fritz Klocke ·

Topics & Keywords

Advanced Surface Polishing Techniques Integrated Circuits and Semiconductor Failure Analysis Advanced machining processes and optimization

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: CIRP Annals

Volume 52, Issue 2, pp. 611-633

DOI: 10.1016/s0007-8506(07)60207-8

Field-Weighted Citation Impact: 6.04

Material Removal Mechanisms in Lapping and Polishing | Researchclopedia

Fraunhofer Society

Olaf Dambon · Fraunhofer Society

Brigid Mullany · Carl Zeiss (Germany)