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Microelectronics Packaging Handbook

19971,149 citationsBook

Authors

Rao Tummala · Georgia Institute of Technology

Eugene J. Rymaszewski · Rensselaer Polytechnic Institute

Alan G. Klopfenstein · AT&T (United States)

Topics & Keywords

3D IC and TSV technologies Electronic Packaging and Soldering Technologies

Publication Details

DOI: 10.1007/978-1-4615-4086-1

Field-Weighted Citation Impact: 76.05

Microelectronics Packaging Handbook | Researchclopedia