Quality inspection in PCBs and SMDs using computer vision techniques

This paper addresses the task of automating the visual inspection of printed circuit board with through hole technique, and surface mount devices (SMD). We have focused on the following quality control of the mounted component using either technology: component twist, or pin defects. A comparison of binarization techniques as well as twist angle estimation methods have been carried out. For inspection of pin defects various morphological image processing techniques have been applied.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>