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Sixty-gigahertz power (PA) and low-noise (LNA) amplifiers have been implemented, based on algorithmic design methodologies for mm-wave CMOS amplifiers, in a 90-nm RF-CMOS process with thick 9-metal-layer Cu backend and transistor f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> /f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">MAX</sub> of 120 GHz/200 GHz. The PA, fabricated for the first time in CMOS at 60 GHz, operates from a 1.5-V supply with 5.2 dB power gain, a 3-dB bandwidth >13 GHz, a P <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1dB</sub> of +6.4 dBm with 7% PAE and a saturated output power of +9.3 dBm at 60 GHz. The LNA represents the first 90-nm CMOS implementation at 60 GHz and demonstrates improvements in noise, gain and power dissipation compared to earlier 60-GHz LNAs in 160-GHz SiGe HBT and 0.13-mum CMOS technologies. It features 14.6 dB gain, an IIP <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> of -6.8 dBm, and a noise figure lower than 5.5 dB, while drawing 16 mA from a 1.5-V supply. The use of spiral inductors for on-chip matching results in highly compact layouts, with the total PA and LNA die areas with pads measuring 0.35times0.43 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and 0.35times0.40 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , respectively
Published in: IEEE Journal of Solid-State Circuits
Volume 42, Issue 5, pp. 1044-1057