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High-temperature lead-free solders: Properties and possibilities

2009344 citationsJournal Article

Authors

Katsuaki Suganuma · Osaka University

Seongjun Kim · Osaka University

Keun‐Soo Kim · Osaka University

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Metallurgical and Alloy Processes

Publication Details

Published in: JOM

Volume 61, Issue 1, pp. 64-71

DOI: 10.1007/s11837-009-0013-y

Field-Weighted Citation Impact: 15.19

High-temperature lead-free solders: Properties and possibilities | Researchclopedia