WAFER LEVEL CAMERAS – NOVEL FABRICATION AND PACKAGING TECHNOLOGIES

This paper explores the latest fabrication techniques and packaging technologies for Wafer Level Cameras (WLC), focusing on the challenges and solutions throughout the manufacturing process. It highlights the importance of performance improvements and optimization of manufacturing methods for mobile phone cameras, emphasizing the role of Wafer Level Packaging (WLP) and wafer-level optics in addressing the demand for smaller form factors and cost reduction. Key aspects include the replication of microlenses, alignment issues, and the use of UV-curable materials for lens stacking and microlens replication. The paper concludes with a discussion on optical measurement technology for quality assurance.