Building pixel detector modules in multi chip module deposited technology

20052 citationsJournal Article

Authors

K. H. Becks · University of Wuppertal

T. Flick · University of Wuppertal

C. Grah · University of Wuppertal

P. Gerlach · University of Wuppertal

P. Mättig · University of Wuppertal

Abstract

The MCM-D technique has been used to build hybrid pixel detector modules and single chip assemblies with optimized sensor geometry. Results of test measurements in both a laboratory and a test beam environment are given.

Topics & Keywords

Particle Detector Development and Performance CCD and CMOS Imaging Sensors Radiation Detection and Scintillator Technologies

Publication Details

Published in: IEEE Symposium Conference Record Nuclear Science 2004.

Volume 2, pp. 1241-1244

DOI: 10.1109/nssmic.2004.1462426

Field-Weighted Citation Impact: 2.47

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Building pixel detector modules in multi chip module deposited technology

Authors

Abstract

Topics & Keywords

Publication Details