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A Brief Review on High-Temperature, Pb-Free Die-Attach Materials

201890 citationsReview

Authors

Hongwen Zhang · Indium Corporation (United States)

Jonathan Minter · Indium Corporation (United States)

Ning-Cheng Lee · Indium Corporation (United States)

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Intermetallics and Advanced Alloy Properties

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: Journal of Electronic Materials

Volume 48, Issue 1, pp. 201-210

DOI: 10.1007/s11664-018-6707-6

Field-Weighted Citation Impact: 4.17

A Brief Review on High-Temperature, Pb-Free Die-Attach Materials | Researchclopedia