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Water immersion cooling of high power density electronics

2019214 citationsJournal Article

Authors

Patrick Birbarah · University of Illinois Urbana-Champaign

Tarek Gebrael · University of Illinois Urbana-Champaign

Thomas Foulkes · University of Illinois Urbana-Champaign

Andrew Stillwell · University of Illinois Urbana-Champaign

Alexandra Moore · San Antonio College

Robert C. N. Pilawa-Podgurski · University of California, Berkeley

Nenad Miljkovic

Topics & Keywords

Thermal properties of materials Heat Transfer and Optimization Heat Transfer and Boiling Studies

UN Sustainable Development Goals

Affordable and clean energy

Publication Details

Published in: International Journal of Heat and Mass Transfer

Volume 147, pp. 118918-118918

DOI: 10.1016/j.ijheatmasstransfer.2019.118918

Field-Weighted Citation Impact: 4.32

Water immersion cooling of high power density electronics | Researchclopedia

· Kyushu University