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Assembly and Reliability of Lead-Free Solder Joints

202067 citationsBook

Authors

John H. Lau · Nanya Technology (Taiwan)

Ning-Cheng Lee · Indium Corporation (United States)

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Engineering and Materials Science Studies

Publication Details

DOI: 10.1007/978-981-15-3920-6

Field-Weighted Citation Impact: 20.28

Assembly and Reliability of Lead-Free Solder Joints | Researchclopedia