Impact of Grinding of Printed Circuit Boards on the Efficiency of Metal Recovery by Means of Electrostatic Separation

This paper analyses the impact of the method of grinding printed circuit boards (PCBs) in a knife mill on the efficiency and purity of products obtained during electrostatic separation. The separated metals and plastics and ceramics can be used as secondary raw materials. This is in line with the principle of circular economy. Three different screen perforations were used in the mill to obtain different sizes of ground grains. Moreover, the effect of cooling the feed to cryogenic temperature on the final products of separation was investigated. The level of contamination of the concentrate, intermediate, and waste obtained as a result of the application of fixed, determined electrostatic separation parameters was assessed using ICP-AES, SEM–EDS, XRD, and microscopic analysis as well as specific density. The yields of grain classes obtained from grinding in a knife mill were tested through sieve analysis and by using a particle size analyser. The test results indicate that using a knife mill with a 1 mm screen perforation along with cooling the feed to cryogenic temperature significantly improves the efficiency of the process. The grinding products were characterised by the highest release level of the useful substance—metals in the free state. The purity of the concentrate and waste obtained from electrostatic separation was satisfactory, and the content of the intermediate, in which conglomerates of solid metal–plastic connections were present, was very low. The yield of concentrate and waste amounted to 26.2% and 71.0%, respectively. Their purity, reflected in the content of the identified metals (valuable metals), was at the level of 93.3% and 0.5%, respectively. In order to achieve effective recovery of metals from PCBs by means of electrostatic separation, one should strive to obtain a feed composed of grains <1000 μm and, optimally, <800 μm.