Transceiver ASIC in HVCMOS Technology for 3D Ultrasound Computer Tomography

Abstract3D Ultrasound Computer Tomography (3D USCT) is an imaging method for the early de-tection of breast cancer. It provides three-dimensional multimodal images of the breast. Thenew 3D USCT device developed currently at Karlsruhe Institute of Technology containsmore than two thousand ultrasound transducers placed in a water-filled aperture where thepatient submerges one breast. The ultrasound transducers are grouped as transducer arraysystems (TAS) of 18 receiver (RX) and transmitter (TX) elements. The transducer front-end electronics contain high-voltage (HV) and low-voltage (LV) amplifiers and switcheswhich are implemented as an application-specific integrated circuit (ASIC). This contribu-tion presents a patented mixed signal, multichannel, transceiver ASIC developed in a com-mercial 350 nm high-voltage CMOS (HV-CMOS) process. The HV-CMOS process provideslow-voltage and high-voltage transistors that can be combined on the same substrate. TheHV transistors can sustain voltages up to 120 V.