Fundamentals of Microsystems Packaging

Chapter 1: Introduction to Microsystems Packaging. Chapter 2: The Role of Packaging in Microelectronics Chapter 3: The Role of Packaging in Microsystems. Chapter 4: Fundamentals of Electrical Package Design. Chapter 5: Fundamentals of Design for Reliability. Chapter 6: Fundamentals of Thermal Management. Chapter 7: Fundamentals of Single Chip Packaging. Chapter 8: Funamentals of Multichip Packaging. Chapter 9: Fundamentals of IC Assembly. Chapter 10: Fundamentals of Water-Level Packaging. Chapter 11: Fundamentals of Passives: Discrete, Integrated, and Embedded. Chapter 12: Fundamentals of Optoelectronics. Chapter 13: Fundamentals of RF Packaging. Chapter 14: Fundamentals of Microelectromechanical Systems. Chapter 15: Fundamentals of Sealing and Encapsulation. Chapter 16: Fundamentals of System-Level PWB Technologies. Chapter 17: Fundamentals of Board Assembly. Chapter 18: Fundamentals of Packaging Materials and Processes. Chapter 19: Fundamentals of Electrical Testing. Chapter 20: Fundamentals of Package Manufacturing. Chapter 21: Fundamentals of Microsystems Design for the Environment. Chapter 22: Fundamentals of Microsstems Reliability. Glossary.