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Thermosets for electric applications

20183 citationsBook Chapter

Authors

K. Netting · Gurit (United Kingdom)

Topics & Keywords

Electronic Packaging and Soldering Technologies Surface and Thin Film Phenomena Copper Interconnects and Reliability

UN Sustainable Development Goals

Affordable and clean energy

Publication Details

Published in: Elsevier eBooks

DOI: 10.1016/b978-0-08-101021-1.00013-7

Field-Weighted Citation Impact: 1.59

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