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Reuse Methodology Manual for System-on-a-Chip Designs

1998142 citationsBook

Authors

Michael J. Keating · Osys Technology

Pierre Bricaud · Mentor Technologies

Topics & Keywords

3D IC and TSV technologies Manufacturing Process and Optimization

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

DOI: 10.1007/978-1-4757-2887-3

Field-Weighted Citation Impact: 4.48

Reuse Methodology Manual for System-on-a-Chip Designs | Researchclopedia