Transient Thermal Control Simulation and Analysis Using Reduced Order Modeling of an Automotive Package Test System

The following study explores a method for efficient transient thermal simulation and analysis of complex systems. For the study, a semiconductor device test cell used during automotive semiconductor testing, was selected. The method utilizes a combination of Simcenter Flotherm Computational Fluid Dynamic (CFD) modeling and Boundary Condition Independent - Reduced Order Modeling (BCI-ROM) techniques. The study focuses on a real-world, AEC-Grade 0, quality validation test case of a Vehicle Dynamics Systems (VDS) low cost, low power, over molded semiconductor device. Predictive die junction temperature results are correlated to empirical embedded t-diode temperature data for three device test conditions (unpowered, low voltage, and high voltage) under varying system setpoints. The study presents full test flow, transient, die junction temperature simulation results for standard and advanced thermal control options.