Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder

The aims of the research are to improve the reliability and lifetimes of solder joints to contribute to the green economy, by reducing waste and extending recycling times. The objectives of the work are; to improve the materials properties of various solders used for attaching die/flip chip packages to PCBs by adding nanoparticles to the mix, to fabricate industrial test samples using flip chips soldered to PCBs, to test the reliability of the solder through accelerated testing, to examine failure modes and lifetime extensions.