Why use ultrashort pulsed lasers for laser microwelding of dissimilar materials

We will present recent advances in direct bonding of dissimilar materials like glass to metal, silicon or ceramics using ultrashort lasers. The process can potentially displace traditional bonding techniques such as epoxy, diffusion, anodic, etc offering a clean, fast and flexible new alternative. It relies on highly controlled laser heat input from <10ps pulses along a user-defined toolpath at the material interface and has been proven to work on various material combinations including BK7, quartz, fused silica, sapphire glasses of varying size, thickness and shape with metals (aluminium, s.steel, titanium, etc), silicon and ceramics (silicon nitride).