P-WLCSP Advanced Packaging Enabling Next Generation Medical Device Applications

Flexible hybrid microelectronics systems are being introduced for wearables, implants, drug delivery, human-machine interfaces, rapid diagnostics and more. These novel medical devices rely on leading-edge thin and flexible microelectronics. Semiconductor-on-Polymer (SoP) 300mm SoP-TM, is a new protected wafer level chip scale advanced packaging process (P-WLCSP) producing six-side (6S) die protection without use of reconstitution. The process produces the thinnest and only physically flexible packaged ICs in the world. SoP packaged devices are currently being adopted in a variety of new medical device products. The new advanced packaging process enhances die strength for CMOS ICs bending to a 5 mm radius of curvature to meet requirements for next generation medical device form factors. This presentation will include examples of new medical devices being enabled by ultra-thin SoP-TM packaged ICs. New applications include ocular, embedded, implants, and labeling. Reliability data such as accelerated stress tests, die strength, operating lifetime and thermal testing are key areas of investigation for the new P-WLCSP technology that will be presented. The presentation will also include an update for ultra-thin device reliability test methods under consideration for new SEMI standards.