Effect of ultrasonic power on the morphology evolution of wedge bonded interface between Al and Cu wires

Abstract The integrated circuit industry is one of the fastest growing and most competitive industries in the world today, and it is the core industry of the electronics industry. From the perspective of the entire industrial structure, integrated circuit semiconductor manufacturing is mainly divided into chip manufacturing and packaging testing. In the field of integrated circuit packaging, wire bonding has become the most commonly used technology in the field of micro-connection. In order to solve the problem of insufficient consistency and reliability of solder joint morphology during bonding, aluminum wire and copper wire were bonded on pure aluminum and pure copper substrates under different process parameters. The reliability of the bonding point was tested by destructive tensile test. Combined with scanning electron microscopy, white light interferometer, metallographic microscope and other analytical testing methods, the morphology observation and composition analysis of the bonding interface after failure were carried out to explore the failure mechanism of the bonding joint. The results show that the vast majority of the bonding point dimensions and the average pull-off force increase with the increase of the ultrasonic power level, but the 15 mil Al-Cu experimental group produces a large fluctuation in the average pull-off force with the increase of the ultrasonic power, which is very unstable.