Scanning Electron Microscopy for Advanced Semiconductor Packaging: From Sample Preparation to Characterization and Failure Analysis

20250 citationsJournal Article

Authors

Paweł Nowakowski · Research Support Instruments (United States)

Abstract

Abstract Presentation slides for the ISTFA 2025 Tutorial session “Scanning Electron Microscopy for Advanced Semiconductor Packaging: From Sample Preparation to Characterization and Failure Analysis.”

Topics & Keywords

Electron and X-Ray Spectroscopy Techniques Integrated Circuits and Semiconductor Failure Analysis 3D IC and TSV technologies

Publication Details

Published in: Proceedings - International Symposium for Testing and Failure Analysis

Volume 85229, pp. n1-n54

DOI: 10.31399/asm.cp.istfa2025tp00n1

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Scanning Electron Microscopy for Advanced Semiconductor Packaging: From Sample Preparation to Characterization and Failure Analysis

Authors

Abstract

Topics & Keywords

Publication Details