Panel RDL Interposer or Substrate (PRIS) for a Vertical-Cavity Surface-Emitting Laser (VCSEL)

20250 citationsJournal Articlebronze Open Access

Authors

Chia-Yu Peng · Micron Corporation (United States)

Kai Pan · National Taiwan University

Puru Bruce Lin · Micron Corporation (United States)

Yun-Cheng Yang · National Taiwan University

Kaiming Yang · Micron Corporation (United States)

Cheng-Ta Ko · Micron Corporation (United States)

Jinsheng Wang

Abstract

In this study, the transformation of high-speed electrical signals into optical signals using a glass panel RDL interposer or substrate (PRIS) integrated with a vertical-cavity surface-emitting laser (VCSEL) chip is investigated for co-packaged optics (CPO) applications. Emphasis is placed on the design, fabrication, and electrical and optical characterization of the package. S-parameters simulations are performed and compared with experimental results. In addition, a 56 Gbps PAM-4 optical eye diagram is measured and characterized.

Topics & Keywords

Semiconductor Lasers and Optical Devices Photonic and Optical Devices Optical Network Technologies

Publication Details

Published in: IMAPSource Proceedings

Volume 2025, Issue Symposium

DOI: 10.4071/001c.147228

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Panel RDL Interposer or Substrate (PRIS) for a Vertical-Cavity Surface-Emitting Laser (VCSEL)

Authors

Abstract

Topics & Keywords

Publication Details