Novel Multi-Nozzle Jet Impingement Liquid Cold Plate for Cooling of High-Power Density Electronic Chip

This work presents a novel multi-nozzle jet impingement liquid cold plate (MJILCP) designed to improve the cooling performance of high-power electronic chips. The proposed cooling system focuses on addressing thermal hotspots and ensuring uniform temperature distribution, challenges often encountered with conventional cooling technologies such as traditional microchannel liquid cold plates. Three-dimensional numerical investigations were conducted to evaluate the effectiveness of the MJILCP for a thermal design power (TDP) of 1000 W. Its performance was compared with a skived-fin-channel liquid cold plate (SFCLCP). The liquid coolant used in the study is PG25 at an inlet temperature of $25^{\circ} \mathrm{C}$, with a volumetric flow rate ranging from 0.75 to 2 LPM. The results demonstrated that the MJILCP significantly enhances thermal performance while reducing the pumping power requirement compared to the SFCLCP. The proposed MJILCP can achieve a maximum reduction in thermal resistance of 14.3% and a decrease in pumping power by 19.3% relative to the SFCLCP. Notably, to attain a thermal resistance of $0.0236{ }^{\circ} \mathrm{C} / \mathrm{W}$, the MJILCP requires 48% less pumping power than the SFCLCP. The MJILCP exhibits maximum chip temperatures of $61.72^{\circ} \mathrm{C}$ and $45.26^{\circ} \mathrm{C}$ at flow rates of 0.75 and 2 LPM, respectively. This innovative design paves the way for more efficient thermal management solutions in the electronics industry, meeting the increasing demand for highperformance cooling systems in data centers, power electronics, and telecommunications equipment.