Enhanced Thermal Impedance Analysis with Reduced-Order Modelling: A Fast and Efficient Computational Approach

Thermal impedance analysis plays a vital role in the design and optimization of power electronic modules. Traditional methods, such as Finite Element Analysis (FEA) and experimental testing, while accurate, suffer from significant computational and practical constraints. This paper presents a Linear TimeInvariant Reduced-Order Modelling (LTI-ROM) approach that significantly improves computational efficiency while maintaining high accuracy in modeling transient thermal behaviour. By simplifying complex thermal systems into reduced-order models, the proposed method enables rapid temperature prediction and provides fast insights into thermal coupling effects in multi-chip power modules, which can further be integrated into real-time thermal monitoring and adaptive cooling strategies, improving thermal management in modern power electronic applications.