Latest Developments of the X-ray Inspection Technology for PCBAs and Microelectronics Devices

ABSTRACT Traditionally, X-ray technology has been widely used for inspecting optically hidden joints and other features within PCB assemblies and advanced microelectronics components and systems. With ever growing trends of size reduction and higher complexity, the inspection challenges are growing and driving the development and improvement of the X-ray inspection systems. There are two main flavors of X-ray inspection equipment: inline (AXI), and standalone (MXI) systems. Both types of systems offer 2D and 3D inspection techniques. 2D is usually much faster than 3D, but the 3D techniques deliver further inspection capabilities via virtual cross-sectioning techniques. The MXI systems can also be found in the failure analysis labs and offer further analytical capabilities in the form of porosity measurements, solder reflow simulators, and others. Due to their higher resolution and flexibility, in many cases the MXI systems are used to verify the AXI results and fine tune the AXI algorithms. The MXI systems also feature some automation capabilities, but these are less developed and slower compared to the AXIs. There is ever growing demand for the AXI and MXI systems to communicate with each other and with other machines in the SMT line in accordance with the Industry 4.0 smart manufacturing process. This paper provides an overview of some of the latest technical developments in the X-ray inspection technology for the electronics industry.