Requirements for the Filler Material Solder Paste for Combinations of Different Technologies (SMT, COB, FC and LE/PE)

ABSTRACT A trend towards miniaturization has been evident since the introduction of SMD technology (SMT). This was extended with chip on board (CoB) and flip chip technology, which is still considered state of the art in back-end production in the semiconductor industry. Furthermore, there is an increasing demand for power electronic (LE/PE) modules in many areas of individual branches of industry and a trend here to develop a combination of the above technologies. To date, filler materials based on solder pastes have been qualified for the respective technologies to meet the respective requirements. The article is intended to show which important requirements are necessary for the respective evaluation. It will also discuss which intersections exist that make it possible to fall back on a filler material. The challenges, possible qualification measures, optimizations and limitations will be presented.